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Wafer/wafer/wafer (substrate) holder for chemical etching, electrolytic etching, and electrolytic plating (plating). A clamp type structure that prevents etchant/electrolyte from entering the back of the substrate. φ2 inch/50 mm (square substrates are also possible) compatible. Made of resin.
It is a structure that sandwiches the wafer with four clamps. Etchant/electrolyte does not run around to the backside of the substrate.
The 3mm outer circumference of the surface is outside the processing area.
Compatible with φ2" to 12" (square substrates and other shapes are also supported).
Materials are PEEK, PP, PTFE (body), PVDF (sealing)
You can choose the type of suspension.
For more information is here
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