Model 6000 Fully Automated Mass Production Mask Aligner for Mass Production

Name: Model 6000 Fully Automated Mass Production Mask Aligner for Mass Production
Brand: 協同インターナショナル
Availability: OutOfStock

協同インターナショナル

ASK

Single-sided mask aligner (adhesion/proximity/contact exposure) equipment. Optical back exposure type. Fully automatic/fully automatic. For semiconductors, MEMS, research and development (R&D). For medium volume production. All-computer-controlled, throughput of 180 wafers per hour is possible. Made by OAI.

For more information is here

model	6000
Substrate size	50mm～200mm wafer/square or 200mm to 300mm wafer/square 100um to 7mm thickness 7mm to 10mm warpage
Mask size	-
Alignment stage control	XY movement: ±6.5mm Z motion: 1500µm Rotation: ±5°
Alignment accuracy	One side: 0.5µm Both sides: <2µm (3σ)
Exposure time	1s-999s (0.1s intervals)
Exposure Mode: Resolution	Proximity, soft contact, hard contact, vacuum contact
throughput	-
Incidental equipment	Power supply: 220V Vacuum line, air line or N2 line, exhaust line
size	1651mH x 2184mmW x 1364mmD

Quantity must be 1 or more