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Model 6000 Fully Automated Mass Production Mask Aligner for Mass Production

Vendor 協同インターナショナル

Single-sided mask aligner (adhesion/proximity/contact exposure) equipment. Optical back exposure type. Fully automatic/fully automatic. For semiconductors, MEMS, research and development (R&D). For medium volume production. All-computer-controlled, throughput of 180 wafers per hour is possible. Made by OAI.

For more information is here

model 6000
Substrate size 50mm~200mm wafer/square or
200mm to 300mm wafer/square 100um to 7mm thickness 7mm to 10mm warpage
Mask size -
Alignment stage control XY movement: ±6.5mm
Z motion: 1500µm
Rotation: ±5°
Alignment accuracy One side: 0.5µm
Both sides: <2µm (3σ)
Exposure time 1s-999s (0.1s intervals)
Exposure Mode: Resolution Proximity, soft contact, hard contact, vacuum contact
throughput -
Incidental equipment Power supply: 220V
Vacuum line, air line or N2 line, exhaust line
size 1651mH x 2184mmW x 1364mmD
This is a pre order item. We will ship it when it comes in stock.